B32674 ... B32678
MKP DC link
high power series
1.3
General notes on soldering
Permissible heat exposure loads on film capacitors are primarily characterized by the upper cate-
gory temperature T max . Long exposure to temperatures above this type-related temperature limit
can lead to changes in the plastic dielectric and thus change irreversibly a capacitor's electrical
characteristics. For short exposures (as in practical soldering processes) the heat load (and thus
the possible effects on a capacitor) will also depend on other factors like:
Pre-heating temperature and time
Forced cooling immediately after soldering
Terminal characteristics:
diameter, length, thermal resistance, special configurations (e.g. crimping)
Height of capacitor above solder bath
Shadowing by neighboring components
Additional heating due to heat dissipation by neighboring components
Use of solder-resist coatings
The overheating associated with some of these factors can usually be reduced by suitable coun-
termeasures. For example, if a pre-heating step cannot be avoided, an additional or reinforced
cooling process may possibly have to be included.
EPCOS recommends the following conditions:
Pre-heating with a maximum temperature of 110 ° C
Temperature inside the capacitor should not exceed the following limits:
MKP/MFP 110 ° C
MKT 160 ° C
When SMD components are used together with leaded ones, the leaded film capacitors should
not pass into the SMD adhesive curing oven. The leaded components should be assembled af-
ter the SMD curing step.
Leaded film capacitors are not suitable for reflow soldering.
Uncoated capacitors
For uncoated MKT capacitors with lead spacings ≤ 10 mm (B32560/B32561) the following mea-
sures are recommended:
pre-heating to not more than 110 ° C in the preheater phase
rapid cooling after soldering
Please read Cautions and warnings and
Important notes at the end of this document.
Page 16 of 22
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相关代理商/技术参数
B32678G4206K 功能描述:薄膜电容器 20uF 450volts 10% 4 Pin 52.5mmL/S RoHS:否 制造商:Cornell Dubilier 产品类型: 电介质:Polyester 电容:0.047 uF 容差:10 % 电压额定值:100 V 系列:225P 工作温度范围:- 55 C to + 85 C 端接类型:Radial 引线间隔:9.5 mm
B32678G4256K 功能描述:薄膜电容器 25uF 450volts 10% 4 Pin 52.5mmL/S RoHS:否 制造商:Cornell Dubilier 产品类型: 电介质:Polyester 电容:0.047 uF 容差:10 % 电压额定值:100 V 系列:225P 工作温度范围:- 55 C to + 85 C 端接类型:Radial 引线间隔:9.5 mm
B32678G4306K 功能描述:薄膜电容器 30uF 450volts 10% 4 Pin 52.5mmL/S RoHS:否 制造商:Cornell Dubilier 产品类型: 电介质:Polyester 电容:0.047 uF 容差:10 % 电压额定值:100 V 系列:225P 工作温度范围:- 55 C to + 85 C 端接类型:Radial 引线间隔:9.5 mm
B32678G4356K 功能描述:薄膜电容器 35uF 450volts 10% 4 Pin 52.5mmL/S RoHS:否 制造商:Cornell Dubilier 产品类型: 电介质:Polyester 电容:0.047 uF 容差:10 % 电压额定值:100 V 系列:225P 工作温度范围:- 55 C to + 85 C 端接类型:Radial 引线间隔:9.5 mm
B32678G4406J 功能描述:薄膜电容器 40uF 450volts 5% 4 Pin 52.5mmL/S RoHS:否 制造商:Cornell Dubilier 产品类型: 电介质:Polyester 电容:0.047 uF 容差:10 % 电压额定值:100 V 系列:225P 工作温度范围:- 55 C to + 85 C 端接类型:Radial 引线间隔:9.5 mm
B32678G4406J000 功能描述:CAP FILM 40UF 5% 450VDC RADIAL 制造商:epcos (tdk) 系列:B32678 包装:散装 零件状态:在售 电容:40μF 容差:±5% 额定电压 - AC:- 额定电压 - DC:450V 介电材料:聚丙烯(PP),金属化 ESR(等效串联电阻):2.5 mOhms 工作温度:-40°C ~ 105°C 安装类型:通孔 封装/外壳:径向 大小/尺寸:2.264" 长 x 1.181" 宽(57.50mm x 30.00mm) 高度 - 安装(最大值):1.772"(45.00mm) 端接:PC 引脚 引线间距:2.067"(52.50mm) 应用:DC 链路,DC 滤波 等级:- 特性:长寿命 标准包装:27
B32678G4406K000 功能描述:FILM CAP MKP DC LINK 40F 10% 450 制造商:epcos (tdk) 系列:* 零件状态:有效 标准包装:108
B32678G6156K 功能描述:薄膜电容器 15uF 630volts 10% 4 Pin 52.5mmL/S RoHS:否 制造商:Cornell Dubilier 产品类型: 电介质:Polyester 电容:0.047 uF 容差:10 % 电压额定值:100 V 系列:225P 工作温度范围:- 55 C to + 85 C 端接类型:Radial 引线间隔:9.5 mm